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Note:

• The full product specifications below are from the manufacturer and may contain information related to other package quantities that will not apply to the product that you are reviewing. Please confirm the actual content and/or package quantity from the main product specifications page.
• These specifications may represent the entire product series/model/line to which this product belongs with specific configuration differences between the individual products stated.
• These specifications may have been copied from the same product in other region/country in which case there might be minor differences in region-specific data such as Input Voltage, Terms of Warranty etc.

Status: Launched
Launch Date: Shipping: May 2016
Expected Discontinuance: See Roadmap
Board Form Factor: UCFF (4" x 5")
Socket: Soldered-down BGA
Internal Drive Form Factor: M.2 SSD
# of Internal Drives Supported: 2
Embedded Options Available: No
Lithography: 14 nm
TDP: 45 W
DC Input Voltage Supported: 19 VDC
Recommended Customer Price: N/A
Description: Other features: Includes USB Type C connector for Thunderbolt 3 (40Gbps) USB 3.1 Gen 2 (10Gbps) and DP 1.2; also includes SDXC card slot
Processor Included: Intel® Core™ i7-6770HQ Processor (6M Cache, up to 3.50 GHz)
Product Brief: Link
Additional Information URL: Link
Warranty Period: 3 yrs

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Memory Specifications
Max Memory Size (dependent on memory type): 32 GB
Memory Types: DDR4-2133+ 1.2V, 1.35V SO-DIMM
Max # of Memory Channels: 2
Max Memory Bandwidth: 34.1 GB/s
Max # of DIMMs: 2
ECC Memory Supported ‡: No

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Graphics Specifications
Integrated Graphics ‡: Yes
Graphics Output: Mini-DP 1.2 HDMI 2.0 USB Type C (DP1.2)
Intel® Clear Video Technology: Yes
# of Displays Supported ‡: 3

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Expansion Options
PCI Express Revision: Gen3
PCI Express Configurations ‡: Dual M.2 slots with PCIe x4 lanes
Removable Memory Card Slot: SDXC with UHS-I support
M.2 Card Slot (storage): 2x 22x42,80

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I/O Specifications
USB Revision: 2.0 3.0 3.1
# of USB Ports: 9
USB 2.0 Configuration (External + Internal): 0 + 2
USB 3.0 Configuration (External + Internal): 3B 2F + 2I
Total # of SATA Ports: 2
Max # of SATA 6.0 Gb/s Ports: 2
RAID Configuration: 2x M.2 SATA/PCIe SSD (RAID-0 RAID-1)
Audio (back channel + front channel): 7.1 digital; L+R+mic (F); L+R+TOSLINK (R)
Integrated LAN: 10/100/1000
Integrated Wifi: Intel® Wireless-AC 8260 + BT 4.2
Integrated Bluetooth: Yes
S/PDIF Out Connector: TOSLINK
Additional Headers: CEC, NFC, 2x USB2.0, 2x USB 3.0, FRONT_PANEL

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Package Specifications
Low Halogen Options Available: See MDDS

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Advanced Technologies
Intel® Virtualization Technology for Directed I/O (VT-d) ‡: Yes
Intel® vPro Technology ‡: No
TPM: No
Intel® HD Audio Technology: Yes
Intel® Rapid Storage Technology: Yes
Intel® Virtualization Technology (VT-x) ‡: Yes

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Intel® Data Protection Technology
Intel® AES New Instructions: Yes