Core i3 Dual-core i3-4170 3.7GHz Desktop Processor

Amazing performance and stunning visuals start here.

Get a smooth, seamless visual experience with a 4th generation Intel® Core™ i3 processor, featuring longer battery life and built-in security for deeper protection.

Manufacturer Part Number
BX80646I34170
EAN/UPC
0675901341240,675901341240,0735858298476,735858298476,5032037073479
Full Product Specifications

Note:

  • The full product specifications below are from the manufacturer and may contain information related to other package quantities that will not apply to the product that you are reviewing. Please confirm the actual content and/or package quantity from the main product specifications page.
  • These specifications may represent the entire product series/model/line to which this product belongs with specific configuration differences between the individual products stated.
  • These specifications may have been copied from the same product in other region/country in which case there might be minor differences in region-specific data such as Input Voltage, Terms of Warranty etc.

Essentials
Launch Date: Q1'15
Processor Number: i3-4170
Cache: 3 MB
DMI2: 5 GT/s
# of QPI Links: 0
Instruction Set: 64-bit
Instruction Set Extensions: SSE4.1/4.2 AVX 2.0
Embedded Options Available: No
Lithography: 22 nm
Scalability: 1S Only
Thermal Solution Specification: PCG 2013C

Performance
# of Cores: 2
# of Threads: 4
Processor Base Frequency: 3.7 GHz
TDP: 54 W

Memory Specifications
Max Memory Size (dependent on memory type): 32 GB
Memory Types: DDR3 and DDR3L 1333/1600 at 1.5V
Max # of Memory Channels: 2
Max Memory Bandwidth: 25.6 GB/s
ECC Memory Supported : Yes

Graphics Specifications
Processor Graphics : Intel® HD Graphics 4400
Graphics Base Frequency: 350 MHz
Graphics Max Dynamic Frequency: 1.15 GHz
Graphics Video Max Memory: 1.7 GB
Intel® Quick Sync Video: Yes
Intel® InTru™ 3D Technology: Yes
Intel® Wireless Display: Yes
Intel® Clear Video HD Technology: Yes
# of Displays Supported : 3

Expansion Options
PCI Express Revision: 3.0
PCI Express Configurations : Up to 1x16 2x8 1x8/2x4
Max # of PCI Express Lanes: 16

Package Specifications
Max CPU Configuration: 1
TCASE: 72°C
Package Size: 37.5mm x 37.5mm
Graphics and IMC Lithography: 22 nm
Sockets Supported: FCLGA1150
Low Halogen Options Available: See MDDS

Advanced Technologies
Intel® Turbo Boost Technology : No
Intel® vPro Technology : No
Intel® Hyper-Threading Technology : Yes
Intel® Virtualization Technology (VT-x) : Yes
Intel® Virtualization Technology for Directed I/O (VT-d) : No
Intel® VT-x with Extended Page Tables (EPT) : Yes
Intel® TSX-NI: No
Intel® 64 : Yes
Idle States: Yes
Enhanced Intel SpeedStep® Technology: Yes
Thermal Monitoring Technologies: Yes
Intel® Stable Image Platform Program (SIPP): No

Intel® Data Protection Technology
AES New Instructions: Yes
Secure Key: Yes

Intel® Platform Protection Technology
Trusted Execution Technology : No
Execute Disable Bit : Yes

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.