SSD DC P3600 Series (400GB, 2.5in PCIe 3.0, 20nm, MLC)

This document describes the specifications and capabilities of the Intel® Solid State Drive (SSD) DC P3600 Series.

P3600 Series is a PCIe Gen3 SSD architected with the new high performance controller interface–NVMe (Non-Volatile Memory express) delivering leading performance, low latency and Quality of Service. Matching the performance with world-class reliability and endurance, P3600 Series offers a range of capacity–400GB , 800GB , 1.2TB , 1.6 TB and 2TB in both Add-In card and 2.5-inch form factor.

With PCIe Gen3 support and NVMe queuing interface, P3600 Series delivers excellent sequential read performance of up to 2.8 GB/s and sequential write speeds of up to 1700 MB/s. P3600 Series delivers very high random read IOPS of 450K and random write IOPS of 70K for 4KB operations. Taking advantage of the direct path from the storage to the CPU by means of NVMe, P3600 Series exhibits low latency of less than 20 μ s for sequential access to the SSD.

The 2.5-inch P3600 Series takes advantage of the 8639 connector and provides hot-pluggable removal and insertion providing in-service replacement options.

P3600 Series includes these key features:

  • Consistently High IOPS and throughput
  • Sustained low latency
  • Variable Sector Size and End-to-End data-path protection
  • Enhanced power-loss data protection
  • Power loss protection capacitor self-test
  • Out of band management
  • Thermal throttling and monitoring



Manufacturer Part Number
SSDPE2ME400G410
EAN/UPC
0735858285551,735858285551
Full Product Specifications

Note:

  • The full product specifications below are from the manufacturer and may contain information related to other package quantities that will not apply to the product that you are reviewing. Please confirm the actual content and/or package quantity from the main product specifications page.
  • These specifications may represent the entire product series/model/line to which this product belongs with specific configuration differences between the individual products stated.
  • These specifications may have been copied from the same product in other region/country in which case there might be minor differences in region-specific data such as Input Voltage, Terms of Warranty etc.

  • Capacities:
    • 400GB, 800GB, 1.2TB, 1.6TB, 2TB
  • Components
    • Intel® 20nm MLC NAND Flash Memory
  • PCIe* Gen3 X4
Form Factors
  • 2.5-inch Form Factor
    • 15mm Z-height
    • 8639-compatible connector
  • AIC Form Factor (Add-in Card)
    • Half-height, Half-length
    • Single slot x4 connector
  • Performance1,2
    • Seq R/W: Up to 2600/1700MB/s3
    • IOPS Rnd 70/30 R/W 4KB4: Up to 160K
    • IOPS Rnd 4KB4 R/W: Up to 450/56K
    • Seq Latency (typ) R/W: 20/20μs
  • Operating System Support:
    • Windows* Server 2012 R2, 2012, 2008 R2 x64
    • Windows 7*, Windows 8*, Windows 8.1* (32bit/64bit)
    • RHEL* 6.5, 6.6, 7.0
    • UEFI 2.3.1*
    • SLES11 SP3*
  • Reliability
    • Uncorrectable Bit Error Rate (UBER): 1 sector per 1017 bits read
    • Mean Time Before Failure (MTBF): 2 million hours
    • T10 DIF protection
    • Variable Sector Size: 512, 520, 528, 4096, 4104, 4160, 4224 Bytes
  • Power
    • 2.5-inch: 3.3V and 12V Supply Rail
    • AIC: 3.3V and 12V Supply Rail
    • Enhanced power-loss data protection
    • Active/Idle (TYP): Up to 25W/4W (TYP)
  • Compliance
    • NVM Express* 1.0
    • PCI Express* Base Specification Rev 3.0
    • Enterprise SSD Form Factor Version 1.0a
    • PCI Express Card Electro-Mechanical (CEM) Specification Rev 2.0
  • Certifications and Declarations
    • UL*, CE*, C-Tick*, BSMI*, KCC*, Microsoft WHQL*, VCCI*
  • Endurance Rating
    • Up to 10.95 PBW (Petabytes Written)5 3 Drive Writes/day (JESD219 workload)
Temperature Specification
  • Operating:
    • AIC: 0 to 55° C with specified airflow
    • 2.5-inch: 0 to 35° C ambient, 0 to 70° C case with specified airflow
  • Non-Operating6: -55 to 95° C
  • Temperature monitoring (In-band and by way of SMBUS)
  • Thermal throttling when approaching maximum operating temperature
Airflow
  • AIC (55° C airflow towards IO bracket7)
    • 400GB: 100 LFM
    • 800GB/1.2TB/1.6TB/2.0TB: 300 LFM
  • 2.5-inch (Airflow towards the connector)
    • 400GB: 250/300 LFM (25/35° C)
    • 800GB: 350/500 LFM (25/35° C)
    • 1.2TB/1.6TB/2.0TB: 450/650 LFM (25/35° C)
  • Weight
    • AIC: 400/800GB up to 185gm 1.2TB, 1.6TB, 2TB up to 195gm
    • 2.5-inch: 400/800GB up to 115 gm 1.2TB, 1.6TB, 2TB up to 125gm
  • Shock
    • 2.5-inch: 1,000 G/0.5msec
    • AIC: 50 G Trapezoidal, 170 in/s
  • Vibration
    • Operating: 2.17 GRMS (5-700Hz)
    • Non-Operating: 3.13 GRMS (5-800Hz)
  • Altitude (Simulated)
    • Operating: -1,000 to 10,000 ft
    • Non-Operating: -1,000 to 40,000 ft
  • Product Ecological Compliance
    • RoHS
1. Performance values vary by capacity and form factor
2. Performance specifications apply to both compressible and incompressible data
3. MB/s = 1,000,000 bytes/second
4. 4KB = 4,096 bytes; 8 KB = 8,192 bytes
5. 1PB = 1015 Bytes
6. Please contact your Intel representative for details on the non-operating temperature range
7. Airflow out of server through PCIe Card Slot