Full Product Specifications
Note:
- The full product specifications below are from the manufacturer and may contain information related to other package quantities that will not apply to the product that you are reviewing. Please confirm the actual content and/or package quantity from the main product specifications page.
- These specifications may represent the entire product series/model/line to which this product belongs with specific configuration differences between the individual products stated.
- These specifications may have been copied from the same product in other region/country in which case there might be minor differences in region-specific data such as Input Voltage, Terms of Warranty etc.
- Capacities:
- 400GB, 800GB, 1.2TB, 1.6TB, 2TB
- Components
- Intel® 20nm MLC NAND Flash Memory
- PCIe* Gen3 X4
Form Factors
- 2.5-inch Form Factor
- 15mm Z-height
- 8639-compatible connector
- AIC Form Factor (Add-in Card)
- Half-height, Half-length
- Single slot x4 connector
- Performance1,2
- Seq R/W: Up to 2600/1700MB/s3
- IOPS Rnd 70/30 R/W 4KB4: Up to 160K
- IOPS Rnd 4KB4 R/W: Up to 450/56K
- Seq Latency (typ) R/W: 20/20μs
- Operating System Support:
- Windows* Server 2012 R2, 2012, 2008 R2 x64
- Windows 7*, Windows 8*, Windows 8.1* (32bit/64bit)
- RHEL* 6.5, 6.6, 7.0
- UEFI 2.3.1*
- SLES11 SP3*
- Reliability
- Uncorrectable Bit Error Rate (UBER): 1 sector per 1017 bits read
- Mean Time Before Failure (MTBF): 2 million hours
- T10 DIF protection
- Variable Sector Size: 512, 520, 528, 4096, 4104, 4160, 4224 Bytes
- Power
- 2.5-inch: 3.3V and 12V Supply Rail
- AIC: 3.3V and 12V Supply Rail
- Enhanced power-loss data protection
- Active/Idle (TYP): Up to 25W/4W (TYP)
- Compliance
- NVM Express* 1.0
- PCI Express* Base Specification Rev 3.0
- Enterprise SSD Form Factor Version 1.0a
- PCI Express Card Electro-Mechanical (CEM) Specification Rev 2.0
- Certifications and Declarations
- UL*, CE*, C-Tick*, BSMI*, KCC*, Microsoft WHQL*, VCCI*
- Endurance Rating
- Up to 10.95 PBW (Petabytes Written)5 3 Drive Writes/day (JESD219 workload)
Temperature Specification
- Operating:
- AIC: 0 to 55° C with specified airflow
- 2.5-inch: 0 to 35° C ambient, 0 to 70° C case with specified airflow
- Non-Operating6: -55 to 95° C
- Temperature monitoring (In-band and by way of SMBUS)
- Thermal throttling when approaching maximum operating temperature
Airflow
- AIC (55° C airflow towards IO bracket7)
- 400GB: 100 LFM
- 800GB/1.2TB/1.6TB/2.0TB: 300 LFM
- 2.5-inch (Airflow towards the connector)
- 400GB: 250/300 LFM (25/35° C)
- 800GB: 350/500 LFM (25/35° C)
- 1.2TB/1.6TB/2.0TB: 450/650 LFM (25/35° C)
- Weight
- AIC: 400/800GB up to 185gm 1.2TB, 1.6TB, 2TB up to 195gm
- 2.5-inch: 400/800GB up to 115 gm 1.2TB, 1.6TB, 2TB up to 125gm
- Shock
- 2.5-inch: 1,000 G/0.5msec
- AIC: 50 G Trapezoidal, 170 in/s
- Vibration
- Operating: 2.17 GRMS (5-700Hz)
- Non-Operating: 3.13 GRMS (5-800Hz)
- Altitude (Simulated)
- Operating: -1,000 to 10,000 ft
- Non-Operating: -1,000 to 40,000 ft
- Product Ecological Compliance
1. Performance values vary by capacity and form factor
2. Performance specifications apply to both compressible and incompressible data
3. MB/s = 1,000,000 bytes/second
4. 4KB = 4,096 bytes; 8 KB = 8,192 bytes
5. 1PB = 1015 Bytes
6. Please contact your Intel representative for details on the non-operating temperature range
7. Airflow out of server through PCIe Card Slot